Patent Assignment
Reel/Frame 033926/0038
Assignment of Assignor's Interest
Recorded: 2014-10-09
Pages: 4
Assignors
LO, HSIAO YUN
Executed: 2014-09-25
LIN, YUNG-CHI
Executed: 2014-09-25
HSUEH, YANG-CHIH
Executed: 2014-09-25
WU, TSANG-JIUH
Executed: 2014-09-25
CHIOU, WEN-CHIH
Executed: 2014-09-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnection Structure with Confinement Layer