Assignment of Assignor's Interest

Recorded: 2014-10-15 Pages: 3

Assignor

JIANG, JIA

Executed: 2014-10-15

Assignee

FUTUREWEI TECHNOLOGIES, INC.

5340 LEGACY DRIVE, SUITE 175, PLANO, TEXAS, 75024

Covered Property (1)

Stacked Photonic Chip Coupler for Soi Chip-Fiber Coupling

Patent: 9,435,961 →

Application: 14/515,211 →

Publication: US 2016/0109659

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.