Patent Assignment
Reel/Frame 033957/0361
Assignment of Assignor's Interest
Recorded: 2014-10-15
Pages: 2
Assignors
YU, TSUNG-YUAN
Executed: 2011-10-26
CHEN, HSIEN-WEI
Executed: 2011-10-26
CHEN, YING-JU
Executed: 2011-10-26
LIANG, SHIH-WEI
Executed: 2011-10-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO .8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Devices with Ball Strength Improvement