Patent Assignment
Reel/Frame 033962/0866
Assignment of Assignor's Interest
Recorded: 2014-10-16
Pages: 3
Assignor
INOUE, MASASHI
Executed: 2014-10-03
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Circuit Module Having a Substrate, Semiconductor Chip, and Molding Material Formed by Dicing
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.