Patent Assignment
Reel/Frame 033971/0743
Assignment of Assignor's Interest
Recorded: 2014-10-17
Pages: 3
Assignee
TECHNISCHE UNIVERSITAET BERLIN
STRASSE DES 17. JUNI 135,, BERLIN, 10623, GERMANY
Covered Property
(1)
Solder Material, Method for the Production Thereof and Use Thereof to Join Metal Substrates Without Pressure
Patent:
10,065,273 →
Application:
14/395,212 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.