Patent Assignment
Reel/Frame 034019/0133
Assignment of Assignor's Interest
Recorded: 2014-10-23
Pages: 2
Assignor
TAN, XIAOCHUN
Executed: 2014-09-22
Assignee
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.
A1501, TECHNOLOGY MANSION, EASTERN SOFTWARE PARK, NO. 90, WENSAN ROAD, ZHEJIANG PROVINCE, HANGZHOU, 310012, CHINA
Covered Property
(1)
Multi-Chip Stacked Package and Method for Forming the Same