Patent Assignment
Reel/Frame 034043/0747
Assignment of Assignor's Interest
Recorded: 2014-10-27
Pages: 3
Assignors
ALLEGATO, GIORGIO
Executed: 2014-10-16
FERRERA, MARCO
Executed: 2014-10-12
GARAVAGLIA, MATTEO
Executed: 2014-10-17
CORSO, LORENZO
Executed: 2014-10-16
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, AGRATE BRIANZA, 20864, ITALY
Covered Property
(1)
Method for Manufacturing a Die Assembly Having a Small Thickness and Die Assembly Relating Thereto
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.