Patent Assignment
Reel/Frame 034044/0150
Assignment of Assignor's Interest
Recorded: 2014-10-27
Pages: 4
Assignors
NISHIMURA, GOHKI
Executed: 2014-10-17
KUROYANAGI, TAKUMA
Executed: 2014-10-17
TASAKA, NAOYUKI
Executed: 2014-10-17
TANAKA, SACHIKO
Executed: 2014-10-17
Assignee
TAIYO YUDEN CO., LTD.
16-20, UENO 6-CHOME, TAITO-KU, TOKYO, 110-0005, JAPAN
Covered Property
(1)
Electronic Module Having an Interconnection Substrate with a Buried Electronic Device Therein