IP Library Assignment 034044/0164
Patent Assignment
Reel/Frame 034044/0164

Assignment of Assignor's Interest

Recorded: 2014-10-27 Pages: 2
Assignor
GLICKMAN, MICHAEL JAMES
Executed: 2014-10-24
Assignee
FLEXTRONICS AP, LLC
305 INTERLOCKEN PARKWAY, BROOMFIELD, COLORADO, 80021
Covered Property (1)
Nano-Copper Solder for Filling Thermal Vias
Patent: 9,565,748 →
Application: 14/524,894 →
Publication: US 2015/0114707
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 15, 2017
From: FLEXTRONICS AP, LLC
To: MULTEK TECHNOLOGIES LIMITED
Reel/Frame 042382/0045 →