Patent Assignment
Reel/Frame 034064/0470
Assignment of Assignor's Interest
Recorded: 2014-10-29
Pages: 6
Assignee
BREWER SCIENCE INC.
2401 BREWER DRIVE, ROLLA, MISSOURI, 65401
Covered Property
(1)
Dual-Layer Bonding Material Process for Temporary Bonding of Microelectronic Substrates to Carrier Substrates