Assignment of Assignor's Interest

Recorded: 2014-10-30 Pages: 3

Assignor

CHEN, CHUNFU

Executed: 2011-10-03

Assignee

HENKEL CORPORATION

ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067

Covered Property (1)

Method for Connecting Electrodes and Bonding Composition Used Therefor

Application: 13/213,342 →

Publication: US 2012/0018088

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.