Patent Assignment
Reel/Frame 034189/0980
Assignment of Assignor's Interest
Recorded: 2014-11-17
Pages: 5
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property
(1)
Semiconductor Device and Method for Producing Same Having Multilayer Wiring Structure with Contact Hole Having Hydrophobic Film Formed on Side Surface of the Contact Hole