IP Library Assignment 034194/0556
Patent Assignment
Reel/Frame 034194/0556

Address Change

Recorded: 2014-11-10 Pages: 2
Assignor
HENKEL CORPORATION
Executed: 2013-10-31
Assignee
HENKEL CORPORATION
ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067
Covered Property (1)
Low Voc-Solvent Based Mold Release Agent and Curable Mold Release Compositions Based Thereon
Patent: 7,462,668 →
Application: 10/565,499 →
Publication: US 2006/0247368
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 10, 2014
From: LU, ZHENG; SMITH, RANDY LEE; THIBAULT, TAMARA LYNN; SHAW, DANIEL I.
To: HENKEL CORPORATION
Reel/Frame 034133/0225 →
Assignment of Assignor's Interest Dec 2, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034306/0188 →
Assignment of Assignor's Interest Feb 25, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035029/0927 →