Patent Assignment
Reel/Frame 034196/0967
Assignment of Assignor's Interest
Recorded: 2014-11-18
Pages: 3
Assignee
KYOCERA CORPORATION
6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO-SHI, KYOTO, 612-8501, JAPAN
Covered Property
(1)
Semiconductor Element Housing Package, Semiconductor Device, and Mounting Structure