Patent Assignment
Reel/Frame 034210/0031
Assignment of Assignor's Interest
Recorded: 2014-11-19
Pages: 4
Assignor
TESSERA TECHNOLOGIES IRELAND LIMITED
Executed: 2011-06-27
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Stack Packages Using Reconstituted Wafers
Application:
14/036,684 →
Publication:
US 2014/0027931
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 14, 2014
From: AVSIAN, OSHER; GRINMAN, ANDREY; HUMPSTON, GILES; MARGALIT, MOTI
To: TESSERA TECHNOLOGIES HUNGARY KFT.
Reel/Frame 034174/0456 →
Assignment of Assignor's Interest
Nov 18, 2014
From: TESSERA TECHNOLOGIES HUNGARY KFT.
To: TESSERA TECHNOLOGIES IRELAND LIMITED
Reel/Frame 034196/0659 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →