Patent Assignment
Reel/Frame 034227/0044
Assignment of Assignor's Interest
Recorded: 2014-11-21
Pages: 3
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1, ICHIGAYA-KAGA-CHO 1-CHOME, SHINJUKU KU, TOKYO, 1628001, JAPAN
Covered Property
(1)
Method for Manufacturing Multilayer Wiring Board