Patent Assignment
Reel/Frame 034238/0587
Assignment of Assignor's Interest
Recorded: 2014-11-13
Pages: 3
Assignors
KIM, JIN HA
Executed: 2014-11-10
KIM, JUN KWAN
Executed: 2014-11-10
CHOI, KANG SIK
Executed: 2014-11-10
CHAE, SU JIN
Executed: 2014-11-10
LEE, YOUNG HO
Executed: 2014-11-10
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
3D Semiconductor Integrated Circuit Device and Method of Manufacturing the Same