IP Library Assignment 034250/0329
Patent Assignment
Reel/Frame 034250/0329

Assignment of Assignor's Interest

Recorded: 2014-11-24 Pages: 6
Assignors
UCHIDA, YOSHITAKA
Executed: 2014-11-06
SUGIZAKI, TETSUYA
Executed: 2014-11-10
HIGAKI, TOMOHIRO
Executed: 2014-11-10
Assignees
OHTSUKA POLY-TECH CO., LTD.
4962, OAZA HANEO, NAMEKAWAMACHI, HIKI-GUN, SAITAMA, 355-0811, JAPAN
HONDA MOTOR CO., LTD.
1-1, MINAMI-AOYAMA 2-CHOME, MINATO-KU, TOKYO, 107-8556, JAPAN
Covered Property (1)
Packing and Seal Structure of Battery Module
Patent: 9,644,739 →
Application: 14/551,486 →
Publication: US 2015/0147639