Patent Assignment
Reel/Frame 034271/0841
Assignment of Assignor's Interest
Recorded: 2014-11-26
Pages: 4
Assignors
LEE, JAE SIK
Executed: 2014-11-17
WE, HONG BOK
Executed: 2014-11-17
KIM, DONG WOOK
Executed: 2014-11-17
GU, SHIQUN
Executed: 2014-11-17
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Integrated Device Package Comprising Silicon Bridge in an Encapsulation Layer