Patent Assignment
Reel/Frame 034376/0690
Assignment of Assignor's Interest
Recorded: 2014-12-04
Pages: 6
Assignors
LEI, JIPU
Executed: 2013-11-06
SCHIAFFINO, STEFANO
Executed: 2013-11-08
NICKEL, ALEXANDER H.
Executed: 2013-11-06
NG, MOOI GUAN
Executed: 2013-11-06
BASIN, GRIGORIY
Executed: 2013-12-01
AKRAM, SALMAN
Executed: 2014-11-01
Assignee
KONINKLIJKE PHILIPS N.V.
HIGH TECH CAMPUS, EINDHOVEN, 5656AE, NETHERLANDS
Covered Property
(1)
Chip Scale Light Emitting Device with Metal Pillars in a Molding Compound Formed at Wafer Level
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
Assignment of Assignor's Interest
Nov 9, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 044416/0019 →
Security Interest
Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
Release of Security Interest
Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
Assignment of Assignor's Interest
Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →