Patent Assignment
Reel/Frame 034426/0075
Assignment of Assignor's Interest
Recorded: 2014-12-08
Pages: 4
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING ROAD, CHUTUNG, HSINCHU COUNTY, 31040, TAIWAN
Covered Property
(1)
Molding Package Assembly and Molding Material