Patent Assignment
Reel/Frame 034528/0060
Assignment of Assignor's Interest
Recorded: 2014-12-17
Pages: 6
Assignors
FEGER, CLAUDIUS
Executed: 2014-10-30
GAYNES, MICHAEL
Executed: 2014-10-30
NAH, JAE-WOONG
Executed: 2014-10-30
SHIH, DA-YUAN
Executed: 2014-11-19
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
No Flow Underfill or Wafer Level Underfill and Solder Columns