Patent Assignment
Reel/Frame 034550/0672
Assignment of Assignor's Interest
Recorded: 2014-12-18
Pages: 3
Assignee
KYOCERA CORPORATION
6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO-SHI, KYOTO, 612-8501, JAPAN
Covered Property
(1)
Package for Housing Semiconductor Element and Semiconductor Device