Patent Assignment
Reel/Frame 034586/0704
Assignment of Assignor's Interest
Recorded: 2014-12-26
Pages: 6
Assignors
PAI, YU-CHENG
Executed: 2014-04-10
LIN, CHUN-HSIEN
Executed: 2014-04-10
CHIU, SHIH-CHAO
Executed: 2014-04-10
HSIAO, WEI-CHUNG
Executed: 2014-04-10
SUN, MING-CHEN
Executed: 2014-04-10
SHEN, TZU-CHIEH
Executed: 2014-04-10
CHEN, CHIA-CHENG
Executed: 2014-04-10
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Coreless Packaging Substrate and Fabrication Method Thereof