Patent Assignment
Reel/Frame 034613/0691
Assignment of Assignor's Interest
Recorded: 2015-01-02
Pages: 3
Assignors
CHANG, WEI SEN
Executed: 2014-12-17
CHEN, YU-FENG
Executed: 2014-12-17
CHEN, CHEN-SHIEN
Executed: 2014-12-17
LII, MIRNG-JI
Executed: 2014-12-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Multi-Die Package with Bridge Layer and Method for Making the Same