IP Library › Assignment 034656/0581
Patent Assignment
Reel/Frame 034656/0581

Assignment of Assignor's Interest

Recorded: 2015-01-07 Pages: 3
Assignor
SUSS MICROTEC, INC.
Executed: 2014-02-26
Assignee
SUSS MICROTEC LITHOGRAPHY GMBH
SCHLEISSHEIMER STR. 90, GARCHING, 85748, GERMANY
Covered Property (1)
Debonding Temporarily Bonded Semiconductor Wafers
Patent: 9,472,437 →
Application: 14/577,369 →
Publication: US 2015/0101744
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 7, 2015
From: GEORGE, GREGORY; ROSENTHAL, CHRISTOPHER
To: SUSS MICROTEC INC.
Reel/Frame 034656/0577 →