IP Library Assignment 034681/0432
Patent Assignment
Reel/Frame 034681/0432

Assignment of Assignor's Interest

Recorded: 2015-01-06 Pages: 3
Assignors
KARIYAZAKI, SHUUICHI
Executed: 2014-08-22
OIKAWA, RYUICHI
Executed: 2014-08-26
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Semiconductor Device with Semiconductor Chip and Wiring Layers
Patent: 9,312,216 →
Application: 14/590,291 →
Publication: US 2015/0214142
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →