Patent Assignment
Reel/Frame 034795/0458
Assignment of Assignor's Interest
Recorded: 2015-01-23
Pages: 2
Assignor
SHIRAKI, SATOSHI
Executed: 2014-11-13
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate, Semiconductor Package, and Method for Manufacturing Semiconductor Package