IP Library Assignment 034829/0398
Patent Assignment
Reel/Frame 034829/0398

Assignment of Assignor's Interest

Recorded: 2015-01-28 Pages: 3
Assignor
HWANG, CHI WON
Executed: 2014-05-09
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNTONG-GU, SUWON-SI, GYEONGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property (1)
Conductive Ball Mounting Device
Patent: 9,832,884 →
Application: 14/607,070 →
Publication: US 2015/0264818