Patent Assignment
Reel/Frame 034848/0879
Assignment of Assignor's Interest
Recorded: 2015-01-29
Pages: 2
Assignor
HIGUCHI, YUICHI
Executed: 2014-12-09
Assignee
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
1-61, SHIROMI 2-CHOME, CHUO-KU, OSAKA-SHI, OSAKA, 540-6207, JAPAN
Covered Property
(1)
Semiconductor Device for Use in Flip-Chip Bonding, Which Reduces Lateral Displacement
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.