IP Library Assignment 034855/0167
Patent Assignment
Reel/Frame 034855/0167

Assignment of Assignor's Interest

Recorded: 2015-01-30 Pages: 6
Assignors
TEH, WENG HONG
Executed: 2012-12-04
CHIU, CHIA-PIN
Executed: 2012-12-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
High Density Substrate Routing in Bbul Package
Patent: 9,190,380 →
Application: 13/707,159 →
Publication: US 2014/0159228