IP Library Assignment 034960/0888
Patent Assignment
Reel/Frame 034960/0888

Assignment of Assignor's Interest

Recorded: 2015-02-13 Pages: 2
Assignors
TOKUYAMA, TAKESHI
Executed: 2014-12-22
NAKATSU, KINYA
Executed: 2014-12-24
MIMA, AKIRA
Executed: 2014-12-24
HATTORI, YUKIO
Executed: 2014-12-24
SATOH, TOSHIYA
Executed: 2014-12-22
Assignee
HITACHI AUTOMOTIVE SYSTEMS, LTD.
2520, TAKABA, HITACHINAKA-SHI, IBARAKI, JAPAN
Covered Property (1)
Power Semiconductor Module
Patent: 9,362,261 →
Application: 14/421,508 →
Publication: US 2015/0214205
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →