IP Library › Assignment 035060/0240
Patent Assignment
Reel/Frame 035060/0240

Assignment of Assignor's Interest

Recorded: 2015-03-01 Pages: 3
Assignor
Assignee
ZHONGSHAN INNOCLOUD INTELLECTUAL PROPERTY SERVICES CO.,LTD.
ROOM 222,DIGITALTRADE BUILDING,NO.6 XIANGXING ROAD,TORCH HIGH NEW TECHNOLOGY DEVELOPMENT ZONE, ZHOUSHAN, CHINA
Covered Property (1)
Method for Manufacturing Light Emitting Diode Packages
Patent: 9,040,321 →
Application: 14/191,375 →
Publication: US 2014/0248725
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 26, 2014
From: LIN, HOU-TE; CHEN, PIN-CHUAN; CHEN, LUNG-HSIN
To: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Reel/Frame 032307/0514 →
Assignment of Assignor's Interest Feb 12, 2015
From: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
To: SCIENBIZIP CONSULTING(SHENZHEN)CO.,LTD.
Reel/Frame 034954/0329 →
Assignment of Assignor's Interest Oct 10, 2019
From: ZHONGSHAN INNOCLOUD INTELLECTUAL PROPERTY SERVICES CO.,LTD.
To: SCIENBIZIP CONSULTING(SHENZHEN)CO.,LTD.
Reel/Frame 050709/0949 →