Patent Assignment
Reel/Frame 035066/0373
Assignment of Assignor's Interest
Recorded: 2015-03-02
Pages: 3
Assignee
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
3-1-1 KYOBASHI, CHUO-KU, TOKYO, 104-0031, JAPAN
Covered Property
(1)
Material Structure Prediction Apparatus, Product Manufacturing Method and Material Structure Prediction Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.