Patent Assignment
Reel/Frame 035095/0061
Assignment of Assignor's Interest
Recorded: 2015-03-05
Pages: 7
Assignors
CHENG, CHUN-WEN
Executed: 2015-03-03
CHU, CHIA-HUA
Executed: 2015-03-03
PENG, JUNG-HUEI
Executed: 2015-03-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Mems and Cmos Integration with Low-Temperature Bonding