IP Library › Assignment 035224/0312
Patent Assignment
Reel/Frame 035224/0312

Assignment of Assignor's Interest

Recorded: 2015-03-21 Pages: 2
Assignors
HUYNH, STEVEN
Executed: 2012-11-05
HSU, TSING
Executed: 2012-11-05
Assignee
ACTIVE-SEMI, INC.
P.O. BOX 957, OFFSHORE INCORPORATIONS CENTRE, ROAD TOWN, TORTOLA, VIRGIN ISLANDS, BRITISH
Covered Property (1)
Power Management Multi-Chip Module with Separate High-Side Driver Integrated Circuit Die
Patent: 9,350,245 →
Application: 14/664,850 →
Publication: US 2015/0194893
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 35224 Frame: 312. Assignor(S) Hereby Confirms the Assignment. Feb 14, 2025
From: HUYNH, STEVEN; HSU, TSING
To: ACTIVE-SEMI (BVI), INC.
Reel/Frame 070236/0679 →
Assignment of Assignor's Interest Mar 11, 2025
From: ACTIVE-SEMI (BVI), INC.
To: QORVO INTERNATIONAL PTE. LTD.
Reel/Frame 070478/0096 →