Patent Assignment
Reel/Frame 035236/0287
Assignment of Assignor's Interest
Recorded: 2015-03-24
Pages: 4
Assignors
SPARTIOTIS, KONSTANTINOS
Executed: 2014-05-21
NYKANEN, HENRI TAPIO
Executed: 2014-05-21
LIN, LIMIN
Executed: 2014-05-21
ELMERI, TUOMAS HEIKKI
Executed: 2014-05-21
LAUKKA, PASI JUHANI
Executed: 2014-05-21
Assignee
OY AJAT LTD.
TEKNIIKANTIE 4 B, ESPOO, 02150, FINLAND
Covered Property
(1)
Semiconductor Bump-Bonded X-Ray Imaging Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Name of the 4TH Inventor Previously Recorded on Reel 035236 Frame 0287. Assignor(S) Hereby Confirms the 4TH Inventor's Last Name Was Omitted.
Jan 20, 2016
From: SPARTIOTIS, KONSTANTINOS; NYKANEN, HENRI TAPIO; LIN, LIMIN; LAHTINEN, TUOMAS HEIKKI ELMERI
To: OY AJAT LTD.
Reel/Frame 037565/0063 →
Change of Name
Mar 20, 2024
From: OY AJAT LTD.
To: OY VAREX IMAGING FINLAND LTD.
Reel/Frame 066839/0087 →
Security Interest
Mar 13, 2026
From: VAREX IMAGING CORPORATION
To: ZIONS BANCORPORATION, N.A. DBA ZIONS FIRST NATIONAL BANK
Reel/Frame 075080/0934 →