Patent Assignment
Reel/Frame 035301/0300
Assignment of Assignor's Interest
Recorded: 2015-03-31
Pages: 10
Assignors
BORAAS, MICHAEL A.
Executed: 2015-03-05
KAMATH, VINOD
Executed: 2014-11-14
MILLER, MICHAEL S.
Executed: 2014-11-14
STEINKE, MARK E.
Executed: 2014-11-14
WAKIL, JAMIL A.
Executed: 2015-03-06
Assignee
LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
151, LORONG CHUAN, #02-01, NEW TECH PARK, SINGAPORE, 556741, SINGAPORE
Covered Property
(1)
Overmolded Dual in-Line Memory Module Cooling Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Execution Date of Inventor Michael a. Boraas from 03-05-2015 to 03-04-2015, Previously Recorded at Reel: 035301 Frame: 0300. Assignor(S) Hereby Confirms the Assignment.
May 7, 2015
From: BORAAS, MICHAEL A.; KAMATH, VINOD; MILLER, MICHAEL S.; STEINKE, MARK E.
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 035614/0035 →
Assignment of Assignor's Interest
Sep 9, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD
Reel/Frame 050310/0988 →
Assignment of Assignor's Interest
Jan 10, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 069869/0614 →