Patent Assignment
Reel/Frame 035380/0711
MERGER
Recorded: 2015-04-10
Received: 2015-04-10
Pages: 27
Assignor
RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Executed: 2014-04-01
Assignee
RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
111, NISHI YOKOTE-MACHI, TAKASAKI-SHI, GUNMA, JPX, JAPAN
Covered Applications
(4)
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
App. No. 11/047,660
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
App. No. 10/784,276
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A MOLD
App. No. 10/453,606
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING REINFORCING PATTERNS FOR ENSURING MECHANICAL STRENGTH DURING MANUFACTURE
App. No. 09/987,532
→