Patent Assignment
Reel/Frame 035405/0665
Assignment of Assignor's Interest
Recorded: 2015-04-14
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2015-03-29
CHEN, SHING-CHAO
Executed: 2015-03-24
LIU, CHUNG-SHI
Executed: 2015-03-29
CHENG, MING-DA
Executed: 2015-03-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Die Bonder and Methods of Using the Same