Patent Assignment
Reel/Frame 035410/0118
MERGER
Recorded: 2015-04-10
Received: 2015-04-10
Pages: 13
Assignor
HITACHI YONEZAWA ELECTRONICS CO., LTD.
Executed: 2002-10-01
Assignee
NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
39, 1007, IZUMISAWA, CHITOSE-SHI, HOKKAI-DO, JPX, JAPAN
Covered Applications
(4)
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
App. No. 11/047,660
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
App. No. 10/784,276
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A MOLD
App. No. 10/453,606
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING REINFORCING PATTERNS FOR ENSURING MECHANICAL STRENGTH DURING MANUFACTURE
App. No. 09/987,532
→