Patent Assignment
Reel/Frame 035410/0131
CHANGE OF NAME
Recorded: 2015-04-10
Received: 2015-04-10
Pages: 19
Assignor
NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Executed: 2003-04-01
Assignee
RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
39, 1007, IZUMISAWA, CHITOSE-SHI, HOKKAI-DO, JPX, JAPAN
Covered Applications
(5)
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
App. No. 11/047,660
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
App. No. 10/784,276
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A MOLD
App. No. 10/453,606
→
COMPOSITIONS HAVING A COMBINATION OF IMMEDIATE RELEASE AND CONTROLLED RELEASE CHARACTERISTICS
App. No. 10/268,928
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING REINFORCING PATTERNS FOR ENSURING MECHANICAL STRENGTH DURING MANUFACTURE
App. No. 09/987,532
→