Patent Assignment
Reel/Frame 035468/0366
Assignment of Assignor's Interest
Recorded: 2015-04-22
Pages: 4
Assignee
MEMSIC, INC.
ONE TECHNOLOGY DRIVE, SUITE 325, ANDOVER, MASSACHUSETTS, 01801
Covered Property
(1)
Wafer Level Chip Scale Packaged Micro-Electro-Mechanical-System (Mems) Device and Methods of Producing Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the State of Incorporation from Massachusetts to Delaware Previously Recorded on Reel 035468 Frame 0366. Assignor(S) Hereby Confirms the the State of Incorporation Should Be Delaware.
Aug 4, 2016
From: MAN, PIU FRANCIS; CHENG, ANRU ANDREW
To: MEMSIC, INC.
Reel/Frame 039571/0765 →
Assignment of Assignor's Interest
May 21, 2021
From: MEMSIC INC.
To: MEMSIC SEMICONDUCTOR (TIANJIN) CO., LTD.
Reel/Frame 056308/0918 →