Patent Assignment
Reel/Frame 035503/0487
Assignment of Assignor's Interest
Recorded: 2015-04-27
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2015-04-20
LIU, CHUNG-SHI
Executed: 2015-04-20
LIN, CHIH-WEI
Executed: 2015-04-07
CHENG, MING-DA
Executed: 2015-04-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Packages Having Through Package Vias