Patent Assignment
Reel/Frame 035518/0765
Assignment of Assignor's Interest
Recorded: 2015-04-28
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2015-03-27
CHEN, MING-FA
Executed: 2015-03-20
TSAI, WEN-CHING
Executed: 2015-03-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3D Chip-on-Wafer-on-Substrate Structure with via Last Process