IP Library › Assignment 035548/0019
Patent Assignment
Reel/Frame 035548/0019

Assignment of Assignor's Interest

Recorded: 2015-05-01 Pages: 4
Assignor
Assignee
DAI NIPPON PRINTING CO., LTD.,
1-1, ICHIGAYA-KAGA-CHO 1-CHOME, SHINJUKU-KU, TOKYO-TO, JAPAN
Covered Property (1)
Wet Etchable Laminated Body, Insulation Film, and Electronic Circuit Part Using the Laminated Body and the Film
Patent: 8,066,891 →
Application: 11/543,812 →
Publication: US 2007/0026678
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 20, 2013
From: NIPPON STEEL CHEMICAL CO., LTD.
To: NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
Reel/Frame 030049/0771 →