Patent Assignment
Reel/Frame 035582/0043
Assignment of Assignor's Interest
Recorded: 2015-05-07
Pages: 3
Assignor
SHI, WEI
Executed: 2015-05-06
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods of Forming Integrated Package Structures with Low Z Height 3D Camera