Patent Assignment
Reel/Frame 035585/0095
Assignment of Assignor's Interest
Recorded: 2015-05-07
Pages: 7
Assignors
LEE, JAEHYUNG
Executed: 2015-03-12
KIM, JUNGSIK
Executed: 2015-03-12
LEE, YOUNGDAE
Executed: 2015-03-12
KIM, DUYEUL
Executed: 2015-03-12
YIM, SUNGMIN
Executed: 2015-03-12
PARK, KWANGIL
Executed: 2015-03-12
PARK, CHULSUNG
Executed: 2015-03-12
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having Interconnection in Package and Method for Manufacturing the Same