Patent Assignment
Reel/Frame 035603/0994
Assignment of Assignor's Interest
Recorded: 2015-05-11
Pages: 3
Assignor
PHARAND, SYLVAIN
Executed: 2013-08-20
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Joining a Chip to a Substrate with Solder Alloys Having Different Reflow Temperatures
Application:
14/708,350 →
Publication:
US 2015/0243625
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 10, 2016
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 037941/0684 →
Assignment of Assignor's Interest
Apr 8, 2016
From: GLOBALFOUNDRIES U.S. 2 LLC
To: GLOBALFOUNDRIES INC.
Reel/Frame 038224/0720 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →