Patent Assignment
Reel/Frame 035641/0337
Assignment of Assignor's Interest
Recorded: 2015-05-14
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including Gap in Interconnection Terminals and Methods of Manufacturing the Same